Electro-optical device having a storage capacitor formed by a data line and a potential line

ABSTRACT

An electro-optical device is provided with a plurality of data lines, a plurality of potential lines supplied with a predetermined potential, a driving transistor controlling a current level according to the voltage between the gate and the source, a first storage capacitor which holds the voltage between the gate and a source of the driving transistor, and a light-emitting element. One data line among the plurality of data lines and one potential line among the plurality of potential lines are arranged to be adjacent to each other, and a second storage capacitor holding the potential of the one data line is formed by the one data line and the one potential line.

CROSS-REFERENCE

This is a Continuation of U.S. application Ser. No. 17/752,313, filedMay 24, 2022, which is a Continuation of U.S. application Ser. No.17/025,253, filed Sep. 18, 2020, which is a Continuation of U.S.application Ser. No. 16/585,983, filed Sep. 27, 2019, which is aContinuation of U.S. application Ser. No. 16/393,200, filed Apr. 24,2019, which is a Continuation of U.S. application Ser. No. 15/959,765,filed Apr. 23, 2018, which is a Continuation of U.S. application Ser.No. 13/669,897, filed Nov. 6, 2012, and claims priority to JapanesePatent Application No. 2011-250386, filed Nov. 16, 2011. The entirecontents of the above applications are expressly incorporated byreference herein.

BACKGROUND 1. Technical Field

The present invention relates to an electro-optical device and anelectronic apparatus useful when a pixel circuit is miniaturized, forexample.

2. Related Art

In recent years, various types of electro-optical devices usinglight-emitting elements such as organic light emitting diodes (below,“OLED”) have been proposed. In such electro-optical devices, pixelcircuits including the above-described light-emitting elements,transistors, and the like corresponding to intersections of scanninglines and data lines are generally configured to be providedcorresponding to the pixels of the image to be displayed. In such aconfiguration, when a data signal of a potential according to thegradation level of the pixels is applied to the gate of the transistor,the transistor supplies current according to the voltage between thegate and the source to the light-emitting element. In this manner, thelight-emitting element emits light with a luminance according to thegradation level.

For such electro-optical devices, there is great demand for reduction ofthe display size and an increase in the high definition of the display.In order to achieve both reduction of the display size and an increasein the high definition of the display, since there is a need tominiaturize the pixel circuit, a technique providing the electro-opticaldevice on a silicon integrated circuit, for example, has also beenproposed (for example, refer to JP-A-2009-288435).

Here, when the pixel circuit is miniaturized, it is necessary to controlthe current supplied to the light-emitting element within a microregion. The current supplied to the light-emitting element is controlledaccording to the voltage between the gate and the source of thetransistor; however, in the micro region, the current supplied to thelight-emitting element changes greatly with respect to slight changes inthe voltage between the gate and the source.

Meanwhile, the driving ability of the circuit outputting the data signalis increased in order to charge the data lines in a short time. In acircuit having such a high driving ability, it is difficult to outputdata signals with extremely fine precision.

Further, when the pixel circuit is miniaturized, luminance unevennesscaused by errors generated during manufacturing is generated and thishas led to deterioration in the display quality in some cases.

SUMMARY

An advantage of some aspects of the invention is that it provides anelectro-optical device, and an electronic apparatus for which a highlyprecise data signal is not necessary, and which are capable of supplyingcurrent to a light-emitting element with high precision whilesuppressing the generation of luminance unevenness.

According to an aspect of the invention, there is provided anelectro-optical device including: a plurality of scanning linesextending in a first direction; a plurality of data lines extending in asecond direction; a plurality of potential lines extending in the seconddirection; a plurality of pixel circuits provided corresponding tointersections of the plurality of scanning lines and the plurality ofdata lines; and a driving circuit driving the plurality pixel circuits,in which each of the plurality of pixel circuits includes a drivingtransistor having a first gate, a first source, and a first drain, thedriving transistor controlling a current level according to the voltagebetween the first gate and the first source, a writing transistorelectrically connected between the first gate of the driving transistorand the data lines, a first storage capacitor of which one end iselectrically connected to the gate of the driving transistor and whichholds the voltage between the first gate and source of the drivingtransistor, and a light-emitting element emitting light at a luminanceaccording to the current level, a predetermined potential is supplied toeach of the plurality of potential lines, and, in the plurality of datalines and the plurality of potential lines, a second storage capacitorholding the potential of the data lines is formed by the data lines andthe potential lines which are adjacent to each other.

According to the aspect of the invention, the second storage capacitoris formed by data lines and potential lines which are adjacent to eachother. Since the data lines and potential lines are provided from oneend to the other end of a region provided with a plurality of pixelcircuits, the second storage capacitor has a sufficiently largecapacitance in comparison with the first storage capacitor provided inthe pixel circuit. Further, variation in the capacitance of the secondstorage capacitors of each column depends on errors in the semiconductorprocessing; however, since the second storage capacitor is formed byelectrodes having a large area such as the data lines and the potentiallines, it is possible to reduce the relative variation of thecapacitance of the second storage capacitor.

Here, when the writing transistor is turned on, the gate of the drivingtransistor is electrically connected with the data lines, the firststorage capacitor, and the second storage capacitor. Accordingly, forexample, in a case where the potential of the gate of the writingtransistor is determined by supplying a charge to the first storagecapacitor and the second storage capacitor through the data lines, thepotential of the gate of the driving transistor is determined accordingto the size of the first storage capacitor and the charge accumulated inthe capacitance thereof and the size of the second storage capacitor andthe charge accumulated in the capacitance thereof. More specifically,the charge supplied through the data lines is distributed to the firststorage capacitor and the second storage capacitor; however, since thesecond storage capacitor has a sufficiently large capacitance incomparison with the first storage capacitor, the voltage of the gate ofthe driving transistor is substantially determined according to thecharge accumulated in the second storage capacitor and the capacitanceof the second storage capacitor.

As described above, since the variation of the capacitance of each ofthe plurality of second storage capacitors provided corresponding toeach of the plurality of data lines is small, it is also possible tosuppress variation in each column of the voltage of the gate of thedriving transistor to be small. Accordingly, the electro-optical deviceaccording to the aspect suppresses the generation of display unevennessand is capable of high quality display.

In addition, it is preferable that the above-described electro-opticaldevice further include a third storage capacitor having one endconnected to the data line and another end, the other end of the thirdstorage capacitor is configured such that a data signal having apotential regulating a luminance of the light-emitting element issupplied to the other end of the third storage capacitor.

According to the aspect of the invention, the data signal of thepotential regulating the luminance of the light-emitting element issupplied to one end of the third storage capacitor. The data lines areconnected to the other end of the third storage capacitor and configureone end of the second storage capacitor. Accordingly, the range ofpotential fluctuations of the data lines becomes a value in which therange of potential fluctuations of the data signals is compressedaccording to the capacitance ratio of the third storage capacitor withrespect to the second storage capacitor. Since the second storagecapacitor formed by the data lines and the potential lines has a largecapacitance, the range of potential fluctuations of the data lines canbe compressed to be sufficiently small in comparison with the range ofpotential fluctuations of the data signals. In this manner, even withoutcutting up the data signals with fine precision, it is possible tosupply the current with respect to the light-emitting element with goodprecision.

Further, since the variation of the capacitance of each of the pluralityof second storage capacitors provided corresponding to the plurality ofdata lines as described above is small, it is also possible to suppressthe variation in the compression rate of the potential fluctuations ofthe data lines with respect to the potential fluctuations of the datasignals to be small, and a high quality display in which the generationof luminance unevenness is prevented is possible.

In addition, it is preferable that, in the above-describedelectro-optical device, the pixel circuit further include aninitialization transistor electrically connected between the onepotential line and the light-emitting element.

According to the aspect of the invention, it is possible to suppress theinfluence of the holding voltage of the capacitor having a parasiticeffect upon the light-emitting element.

In addition, it is preferable that, in the above-describedelectro-optical device, the pixel circuit further include alight-emitting control transistor electrically connected between thedriving transistor and the light-emitting element, and a thresholdcompensation transistor electrically connected between the first gateand the first drain of the driving transistor.

According to the aspect of the invention, it is possible to set thepotential of the gate of the driving transistor as a potentialcorresponding to the threshold voltage of the driving transistor, and itis possible to compensate for the variation of the threshold voltage ofeach driving transistor.

Further, in the above-described electro-optical device, the data linesand the potential lines which are adjacent to each other may beconfigured to be provided between two pixel circuits adjacent to eachother in the first direction in the plurality of pixel circuits.

In such a configuration, a form may be set in which, among the datalines and the potential lines which are adjacent to each other, the datalines are electrically connected to one of the two mutually adjacentpixel circuits, and the potential lines are electrically connected tothe other of the two mutually adjacent pixel circuits.

Further, in such a configuration, a form may be set in which each of thedata lines and the potential lines which are adjacent to each other iselectrically connected to one of the two mutually adjacent pixelcircuits.

In any configuration, since the second storage capacitor is formed bymutually adjacent data lines and potential lines, it is not necessary tomake new space, and it is possible to form a large capacitance.

Here, in addition to the electro-optical device, the invention can beconceived as an electronic apparatus having the electro-optical device.Examples of the electronic apparatus typically include displayapparatuses such as a head mounted display (HMD), or an electronicviewfinder.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a perspective view showing a configuration of anelectro-optical device according to a first embodiment of the invention.

FIG. 2 is a view showing a configuration of the same electro-opticaldevice.

FIG. 3 is a view showing a pixel circuit in the same electro-opticaldevice.

FIG. 4 is a plan view showing a structure of the same electro-opticaldevice.

FIG. 5 is a partial cross-sectional view showing the structure of thesame electro-optical device.

FIG. 6 is a timing chart showing operations of the same electro-opticaldevice.

FIG. 7 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 8 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 9 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 10 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 11 is a diagram showing amplitude compression of a data signal inthe same electro-optical device.

FIG. 12 is a view showing characteristics of a transistor in the sameelectro-optical device.

FIG. 13 is a diagram showing the configuration of the electro-opticaldevice according to the second embodiment.

FIG. 14 is a timing chart showing operations of the same electro-opticaldevice.

FIG. 15 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 16 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 17 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 18 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 19 is a view showing a configuration of an electro-optical deviceaccording to a modification example of the invention.

FIG. 20 is a perspective view showing an HMD using the electro-opticaldevice according to the embodiments and the like.

FIG. 21 is a view showing the optical configuration of the HMD.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Below, aspects for embodying the invention will be described withreference to the drawings.

First Embodiment

FIG. 1 is a perspective view showing a configuration of anelectro-optical device 10 according to an embodiment of the invention.

For example, the electro-optical device 10 is a micro display displayingan image in a head mounted display. Detailed description will be givenof the electro-optical device 10 later; however, the device is anorganic EL apparatus in which a plurality of pixel circuits and drivingcircuits or the like driving the pixel circuits are formed on a siliconsubstrate, for example, in which an OLED which is an example of alight-emitting element is used in the pixel circuits.

The electro-optical device 10 is accommodated in an opening in a displayunit or a see-through frame-shaped case 72, and one end of an FPC(Flexible Printed Circuit) substrate 74 is connected thereto. In the FPCsubstrate 74, a control circuit 5 of a semiconductor chip is mountedusing a COF (Chip On Film) technique and a plurality of terminals 76 areprovided and connected to a high-order circuit omitted from thedrawings. Image data is synchronized with a synchronization signal andsupplied from the high-order circuit through the plurality of terminals76. The synchronization signal includes a vertical synchronizationsignal, a horizontal synchronization signal, and a dot clock signal. Inaddition, the image data regulates the gradation level of the pixels ofthe image to be displayed using 8 bits, for example.

The control circuit 5 combines the functions of a power circuit of theelectro-optical device 10 and a data signal output circuit. That is, inaddition to supplying each type of control signal and various types ofpotential generated in accordance with the synchronization signal to theelectro-optical device 10, the control circuit 5 converts the digitalimage data to an analog data signal and performed supply thereof to theelectro-optical device 10.

FIG. 2 is a view showing a configuration of the electro-optical device10 according to the first embodiment. As shown in the drawing, theelectro-optical device 10 is divided broadly into a scanning linedriving circuit 20, a demultiplexer 30, a level shift circuit 40, and adisplay unit 100.

Among these, in the display unit 100, pixel circuits 110 correspondingto the pixels of the image to be displayed are arranged in a matrixshape. In detail, as shown in FIG. 2 , in the display unit 100, m rowsof scanning lines 12 are provided to extend in the X direction (firstdirection), and, (3n) columns of data lines 14 grouped in threes areprovided to extend in the Y direction (second direction) and preservethe electrical insulation between each of the scanning lines 12. Then,pixel circuits 110 corresponding to the intersection portions betweenthe m rows of scanning lines 12 and the (3n) columns of data lines 14are provided. For this reason, in the present embodiment, the pixelcircuits 110 are arranged in a matrix shape with m rows vertically×(3n)columns horizontally.

Here, m and n are both natural numbers. In the matrix of the scanninglines 12 and the pixel circuit 110, in order to distinguish the rows,there are cases where the rows are referred to as 1, 2, 3, . . . ,(m−1), and m in order from the top of the drawing. In the same manner,in order to distinguish between the columns of the matrix of the datalines 14 and the pixel circuits 110, there are cases where the columnsare referred to as 1, 2, 3, . . . , (3n−1), and (3n) in order from theleft of the drawing. In addition, when the integer j of 1 or more to nor less is used in order to generalize and explain the groups of thedata lines 14, it signifies that the data lines 14 of the (3j−2) column,the (3j−1) column, and the (3j) column belong to the j-th group countedfrom the left.

Here, three pixel circuits 110 corresponding to the intersections of thescanning lines 12 of the same row and three columns of the data lines 14belonging to the same group respectively correspond to pixels of R(red), G (green), and B (blue), and these three pixels express one dotof the color image to be displayed. That is, in the present embodiment,a color of one dot is configured to be expressed using additive colormixing according to the emitted light of the OLED corresponding to RGB.

Further, as shown in FIG. 2 in the display unit 100, potential lines 16of (3n+1) column extend in the Y direction (second direction) and areprovided to preserve the mutual electrical insulation with the scanninglines 12. A predetermined potential Vorst is supplied in common to eachpotential line 16 as a reset potential. Here, since the columns of thepotential lines 16 are divided, they will sometimes be referred to asthe potential lines 16 of the 1, 2, 3, . . . , (3n), and (3n+1) columnsin order from the left in the drawing.

Each of the potential lines 16 of the first column to the (3n)-th columnis provided along each of the data lines 14 of the first column to the(3n)-th column. That is, when an integer of 1 or more and (3n) or lessis set as p, the potential lines 16 of the p-th column and the datalines 14 of the p-th column are provided to be adjacent to each other.Among these, the potential lines 16 and the data lines 14 of the secondcolumn to the (3n)-th column are formed between two pixel circuits 110which are adjacent to each other in the X direction.

Further, details will be given below; however, the potential lines 16and the data lines 14 which are adjacent to each other interpose aninsulating body (dielectric). Accordingly, the potential lines 16 andthe data lines 14 which are adjacent to each other are capacitivelycoupled, and a storage capacitor 50 is formed between the two. Thisstorage capacitor 50 functions as a second storage capacitor holding thepotential of the data lines 14. Here, the distance between the potentiallines 16 and the data lines 14 which are adjacent to each other isdetermined such that a capacitance of a necessary size can be obtained.Below, the capacitance of the storage capacitor 50 is denoted as Cdt.

In this manner, the storage capacitor 50 formed by the potential lines16 and the data lines 14 interposing an insulating body i provided fromthe inside of the display unit 100 to the outside when in plan view (inother words, when viewed from a direction orthogonal to the display unit100), or is provided inside the display unit 100. However, in FIG. 2 ,for convenience of description, the storage capacitor 50 is drawn so asto be provided outside of the display unit 100.

Here, the potential Vorst is supplied to the pixel circuits 110 of thefirst column to the (3n)-th column, respectively, through the potentiallines 16 of the second column to the (3n+1)-th column.

Here, the following kind of control signal is supplied by the controlcircuit 5 to the electro-optical device 10 via control signal lines 200.In detail, a control signal Ctr for controlling the scanning linedriving circuit 20, control signals Sel(1), Sel(2), and Sel(3) forcontrolling the selection with the demultiplexer 30, control signals/Sel(1), /Sel(2), and/Sel(3) which had a logic inversion relationshipwith respect to these signals, a negative logic control signal /Gini forcontrolling the level shift circuit 40, and a positive logic controlsignal Gref are supplied to the electro-optical device 10. In addition,in practice, the control signal Ctr includes a plurality of signals suchas a pulse signal or a clock signal, and an enable signal.

In addition, the data signals Vd(1), Vd(2), . . . , and Vd(n) matchingthe selection timing of the demultiplexer 30 are supplied to theelectro-optical device 10 by the control circuit 5 corresponding to thegroups numbered 1, 2, . . . , and n. Here, the maximum value of thepotential that can be taken by the data signals Vd(1) to Vd(n) is set asVmax and the minimum value is set as Vmin.

The scanning line driving circuit 20 generates scanning signals forscanning the scanning lines 12 in order one row at a time throughout theperiod of the frame in accordance with the control signal Ctr. Here, thescanning signals supplied to the scanning lines 12 of rows numbered 1,2, 3, . . . , (m−1), and m are denoted as Gwr(1), Gwr(2), Gwr(3),Gwr(m−1), and Gwr(m).

Here, in addition to the scanning signals Gwr(1) to Gwr(m), the scanningline driving circuit 20 generates various types of control signalssynchronized with the scanning signals for each row and performs supplythereof to the display unit 100; however, these are not drawn in FIG. 2. Further, the period of the frame refers to the period necessary forthe electro-optical device 10 to display an image of 1 cut (frame)portion, for example, if the frequency of the orthogonal synchronizationsignal included in the synchronization signal is 120 Hz, the one cycleportion is a period of 8.3 milliseconds.

The demultiplexer 30 is a collection of transmission gates 34 providedfor each column, and supplies data signals in order to the three columnsconfiguring each group.

Here, the input ends of the transmission gates 34 corresponding to thecolumns (3j−2), (3j−1), and (3j) belonging to the j-numbered groups aremutually connected in common and respective data signals Vd(j) aresupplied to the common terminals.

The transmission gates 34 provided in columns (3j−2) which are the leftend columns in the j-numbered groups are turned on (conduct) when thecontrol signal Sel(1) is the H level (control signal /Sel(1) is the Llevel). Similarly, the transmission gates 34 provided in columns (3j−1)which are the middle columns in the j-numbered groups are turned on whenthe control signal Sel(2) is the H level (when the control signal/Sel(2) is the L level) and the transmission gates 34 provided incolumns (3j) which are the right end columns in the j-numbered groupsare turned on when the control signal Sel(3) is the H level (when thecontrol signal /Sel(3) is the L level).

The level shift circuit 40 has a set of the storage capacitor 44, the Pchannel MOS type transistor 45, and the N channel MOS type transistor 43for each column, and shifts the potential of the data signals outputfrom the output end of the transmission gate 34 of each column. Here,one end of the storage capacitor 44 is connected to a data line 14 ofthe corresponding column and the drain node of the transistor 45 whilethe other end of the storage capacitor 44 is connected to the output endof the transmission gate 34 and the drain node of the transistor 43. Forthis reason, the storage capacitor 44 functions as a third storagecapacitor of which one end is connected to the data lines 14 and datasignals are supplied to the other end. Although omitted from FIG. 2 ,the capacitance of the storage capacitor 44 is set to Crf1.

Here, the storage capacitor 44 is arranged outside the display unit 100(in other words, in the frame area) and is formed from two electrodeswhich are adjacent to each other when viewed from a direction orthogonalto the display unit 100. In this manner, it is possible to form a largecapacitance Crf1 in a comparatively narrow region, and it is possible tonarrow the frame of the electro-optical device 10.

The source nodes of the transistors 45 of each column are connected incommon across each column to a power supply line 61 supplying thepotential Vini as the initial potential, and the control signal /Gini issupplied in common across each column to the gate nodes. For thisreason, the transistor 45 is configured so as to electrically connectthe data lines 14 and the power supply lines 61 when the control signal/Gini is the L level and to perform electrical disconnection when thecontrol signal /Gini is the H level.

In addition, the source nodes of the transistors 43 of each column areconnected in common across each column to the power supply line 62supplying the potential Vref as a predetermined potential, and thecontrol signal Gref is supplied in common across each column to the gatenodes. For this reason, the transistor 43 is configured so as toelectrically connect the node h which is the other end of the storagecapacitor 44 and the power supply lines 62 when the control signal Grefis the H level and to perform electrical disconnection when the controlsignal Gref is the L level.

In the present embodiment, although divided into the scanning linedriving circuit 20, the demultiplexer 30 and the level shift circuit 40for convenience, these may be conceived together as driving circuitsdriving the pixel circuits 110.

Description will be given of the pixel circuits 110 with reference toFIG. 3 . Since each pixel circuit 110 has the same configuration as theothers electrically, here, description will be given taking the pixelcircuit 110 of the i row (3j−2) column positioned at the (3j−2)-thcolumn of the left end side in the groups numbered j, which is an i-throw, as an example. In addition, i is a reference sign of a casegenerally showing rows in which the pixel circuits 110 are arranged, andis an integer of 1 or more and m or less.

As shown in FIG. 3 , the pixel circuit 110 includes P channel MOS typetransistors 121 to 125, an OLED 130, and a storage capacitor 132. Thescanning signal Gwr(i), the control signals Gel(i), Gcmp(i), andGorst(i) are supplied to the pixel circuits 110. Here, the scanningsignal Gwr(i), and the control signals Gel(i), Gcmp(i), and Gorst(i) aresupplied by the scanning line driving circuit 20 corresponding to therespective i rows. For this reason, the scanning signal Gwr(i), and thecontrol signals Gel(i), Gcmp(i), and Gorst(i) are also supplied incommon to pixel circuits of columns other than the (3j−2) column beingfocused on if in the i row.

In the transistor 122, the gate node is connected to the scanning lines12 of the i row, and one of the drain or the source node is connected tothe data lines 14 of the (3j−2)-th column, and the other is respectivelyconnected to the gate node g in the transistor 121, one end of thestorage capacitor 132, and one of the source or the drain of thetransistor 123. That is, the transistor 122 is electrically connectedbetween the gate node g of the transistor 121 and the data lines 14,controls the electrical connection between the gate node g of thetransistor 121 and the data lines 14, and functions as a writingtransistor. Here, the gate node of transistor 121 is denoted as g inorder to be distinguished from other nodes.

In the transistor 121, the source node is connected to the power supplyline 116, and the drain node is respectively connected to the other ofthe source or the drain node of the transistor 123 and the source nodeof the transistor 124. Here, the potential Vel which is the high orderside of the power in the pixel circuit 110 is supplied to the powersupply line 116. The transistor 121 functions as a driving transistordriving current according to the voltage between the gate node and thesource node of the transistor 121.

The control signal Gcmp(i) is supplied to the gate node of thetransistor 123. The transistor 123 controls the electrical connectionbetween the source node and the gate node g of the transistor 121 andfunctions as a threshold compensation transistor.

The control signal Gel(i) is supplied to the gate node of the transistor124 and the drain node is respectively connected to the source node ofthe transistor 125 and the anode 130 a of the OLED 130. In other words,the transistor 124 controls the electrical connection between the drainnode of the transistor 121 and the anode 130 a and functions as alight-emitting control transistor.

The control signal Gorst(i) corresponding to the i row is supplied tothe gate node of the transistor 125, and the drain node is connected tothe potential line 16 of the (3j−1)-th column and preserved at thepotential Vorst. The transistor 125 functions as an initializationtransistor controlling the electrical connection between the potentialline 16 and the anode 130 a.

The other end of the storage capacitor 132 is connected to the powersupply line 116. For this reason, the storage capacitor 132 functions asa first storage capacitor holding the voltage between the gate and thesource of the transistor 121. In the following, the capacitance of thestorage capacitor 132 is denoted as Cpix.

Here, the capacitance Cdt of the storage capacitor 50, the capacitanceCrf1 of the storage capacitor 44, and the capacitance Cpix of thestorage capacitor 132 are set so thatCdt>Crf1>>CpixThat is, Cdt is set to be greater than Crf1, and Cpix is set to besufficiently smaller than Cdt and Crf1.

Since the electro-optical device 10 in the present embodiment is formedon a silicon substrate, the substrate potential of the transistors 121to 125 is set to the potential Vel.

The anode 130 a of the OLED 130 is a pixel electrode providedindividually for each pixel circuit 110. In contrast, the cathode of theOLED 130 is a common electrode 118 common across all of the pixelcircuits 110, and preserved at the potential Vct which is the low orderside of the power in the pixel circuits 110.

In the above-described silicon substrate, the OLED 130 is an element inwhich a white organic EL layer is interposed by an anode and a cathodehaving light permeability. Here, on the output side (cathode side) ofthe OLED 130, a color filter corresponding to any one of RGB issuperimposed.

In such an OLED 130, when the current flows from the anode to thecathode, the holes injected from the anode and the electrons injectedfrom the cathode are recombined in the organic EL layer, excitons areproduced, and white light is generated. The white light generated atthis time passes through a cathode of the opposite side to the siliconsubstrate (anode), is colored by the color filter, and configured to bevisible on the observation side.

Description will be given of the structure of the pixel circuits 110with reference to FIG. 4 and FIG. 5 .

FIG. 4 is a plan view showing a configuration of four mutually adjacentpixel circuits 110 in the vertical and horizontal directions. Inaddition, FIG. 5 is a partial cross-sectional view cut away along lineVA-VA in FIG. 4 .

In addition, FIG. 4 shows the wiring structure of a case where the pixelcircuit 110 of the transmission structure is a plan view from theobservation side; however, for simplicity, the structural body formedafter the second wiring layer to be described later has been omitted.Further, in FIG. 5 , for simplicity, the structural body formed afterthe anode 130 a in the OLED 130 has been omitted.

Here, in each of the above drawings, there are cases where the scalesare made to be different in order to set each layer, each member, eachregion, and the like to a visible size.

As shown in FIG. 5 , each element configuring the pixel circuit 110 isformed on a silicon substrate 150. In the present embodiment, a P typesemiconductor substrate is used as the silicon substrate 150.

On the silicon substrate 150, N wells 160 are formed across almost theentire surface. Here, in FIG. 4 , when shown in plan view, in order toenable the regions where the transistors 121 to 125 are provided to beeasily grasped, only the regions where the transistors 121 to 125 areprovided and the vicinity thereof in the N wells 160 are shown withhatching.

A potential Vel is supplied to the N wells 160 through an N typediffusion layer (not shown). For this reason, the substrate potential ofthe transistors 121 to 125 is the potential Vel.

As shown in FIG. 4 and FIG. 5 , by doping ions in the surface of the Nwells 160, a plurality of P type diffusion layers are formed.Specifically, on the surface of the N wells 160, 8 P type diffusionlayers P1 to P8 are formed for each pixel circuit 110.

These P type diffusion layers P1 to P8 function as sources or drains ofthe transistors 121 to 125.

As shown in FIG. 5 , on the surfaces of the N wells 160 and the P typediffusion layers P1 to P8, a gate insulating layer L0 and gateelectrodes G1 to G5 are formed by patterning.

These gate electrodes G1 to G5 function as gates of each of thetransistors 121 to 125.

As is shown in FIG. 4 and FIG. 5 , the transistor 121 is configured tohave a gate electrode G1, a P type diffusion layer P7 and a P typediffusion layer P8. Among these, the P type diffusion layer P8 functionsas a source of the transistor 121, and the P type diffusion layer P7functions as a drain of the transistor 121.

In addition, the transistor 122 is configured to have a gate electrodeG2, a P type diffusion layer P1 and a P type diffusion layer P2. Amongthese, the P type diffusion layer P1 functions as one of a source or adrain of the transistor 122, and the P type diffusion layer P2 functionsas the other of the source or the drain of the transistor 122.

The transistor 123 is configured to have a gate electrode G3, a P typediffusion layer P2 and a P type diffusion layer P3. Among these, the Ptype diffusion layer P2 functions as one of a source or a drain of thetransistor 123 and the P type diffusion layer P3 functions as the otherof the source or the drain of the transistor 123.

The transistor 124 is configured to have a gate electrode G4, a P typediffusion layer P3 and a P type diffusion layer P4. Among these, the Ptype diffusion layer P3 functions as a source of the transistor 124, andthe P type diffusion layer P4 functions as a drain of the transistor124.

The transistor 125 is configured to have a gate electrode G5, a P typediffusion layer P5 and a P type diffusion layer P6. Among these, the Ptype diffusion layer P5 functions as a source of the transistor 125, andthe P type diffusion layer P6 functions as a drain of the transistor125.

As shown in FIG. 4 , when viewed in plan view, there is a region inwhich a part of the gate electrode G1 and a part of a P type diffusionlayer P8 are overlapped. The storage capacitor 132 is configured by theinterposition of a gate insulating layer L0 by a portion correspondingto the overlapping region in the gate electrodes G1 and the portioncorresponding to the overlapping region in the P type diffusion layerP8.

As shown in FIG. 5 , a first interlayer insulating layer L1 is formed soas to cover the gate electrodes G1 to G5 and the gate insulating layerL0.

By patterning a wiring layer with conductivity of aluminum or the likeon the surface of the first interlayer insulating layer L1, scanninglines 12, power supply lines 116, and signal lines 141 to 143 arerespectively formed and relay nodes N1 to N6 are respectively formed foreach pixel circuit 110. Here, there are cases where these wiring layersformed on the surface of the first interlayer insulating layer L1 arecollectively referred to as first wiring layers.

As shown in FIG. 4 and FIG. 5 , the relay node N1 is connected to the Ptype diffusion layer P1 through a contact hole Ha1 passing through thefirst interlayer insulating layer L1. In other words, the relay node N1is equivalent to one of the source node or the drain node of thetransistor 122. Here, in FIG. 4 , the contact holes are shown asportions having a square mark with a cross inside at portions wheredifferent types of wiring layers are overlapped.

The relay node N2 is connected to the P type diffusion layer P2 throughthe contact hole Ha2 and connected to the gate electrode G1 through thecontact hole Ha11. In other words, the relay node N2 is equivalent tothe gate node g of the transistor 121, and equivalent to the other ofthe source node or the drain node of the transistor 122 and one of thesource or drain node of the transistor 123.

The relay node N3 is connected to the P type diffusion layer P3 throughthe contact hole Ha3 and connected to the P type diffusion layer P7through the contact hole Ha7. In other words, the relay node N3 isequivalent to the drain node of the transistor 121, and equivalent tothe other of the source or the drain node of the transistor 123 and thesource node of the transistor 124.

The relay node N4 is connected to the P type diffusion layer P4 throughthe contact hole Ha4 and connected to the P type diffusion layer P5through the contact hole Ha5. In other words, the relay node N4 isequivalent to the drain node of the transistor 124, and equivalent tothe source node of the transistor 125.

The relay node N5 is connected to the P type diffusion layer P6 throughthe contact hole Ha6. In other words, the relay node N5 is equivalent tothe drain node of the transistor 125.

The relay node N6 is connected to the P type diffusion layer P8 througha contact hole Ha8. That is, the relay node N6 is equivalent to thesource node of the transistor 121.

The signal line 141 is connected to the gate electrode G4 through acontact hole Ha14. Here, a control signal Gel(i) corresponding to thepixel circuit 110 is supplied to the signal line 141.

The signal line 142 is connected to the gate electrode G5 through acontact hole Ha15. Here, a control signal Gorst(i) corresponding to thepixel circuit 110 is supplied to the signal line 142.

The signal lines 143 are connected to the gate electrode G3 through acontact hole Ha13. Here, the control signal Gcmp(i) corresponding to thepixel circuits 110 is supplied to the signal lines 143.

The scanning line 12 is connected to the gate electrode G2 through acontact hole Ha1 ². The power supply line 116 is connected to the P typediffusion layer P8 through a contact hole Ha9.

Here, the contact holes Ha2 to Ha9 and the contact holes Ha11 to Ha15are contact holes passing through the first interlayer insulating layerL1.

As shown in FIG. 5 , the second interlayer insulating layer L2 is formedso as to cover the first wiring layer and the first interlayerinsulating layer L1.

By patterning a conductive wiring layer of aluminum or the like on thesurface of the second interlayer insulating layer L2, the data lines 14and the potential lines 16 are respectively formed and, for each pixelcircuit 110, the relay node N11 and the relay node N12 are respectivelyformed. Here, there are cases where the wiring layers formed on thesurface of these second interlayer insulating layers L2 are collectivelyreferred to as second wiring layers.

As shown in FIG. 4 , the relay node N11 is connected to the relay nodeN4 through the contact hole Hb2.

The relay node N12 is connected to the relay node N6 through the contacthole Hb4 and connected to the power-supply line 116 through the contacthole Hb5. For this reason, the power supply line 116 is connected to theP type diffusion layer P8 (that is, the source of the transistor 121)through the relay node N12 and relay node N6.

The data lines 14 are connected to the relay node N1 through the contacthole Hb1. For this reason, the data lines 14 are connected to the P typediffusion layer P1 through the relay node N1 (that is, one of the sourceor the drain of the transistor 122).

The potential line 16 is connected to the relay node N5 through thecontact hole Hb3. For this reason, the potential line 16 is connected tothe P type diffusion layer P6 (that is, the drain of the transistor 125)through the relay node N5. In addition, the contact holes Hb1 to Hb5 arecontact holes passing though the second interlayer insulating layer L2.

As shown in FIG. 5 , the third interlayer insulating layer L3 is formedso as to cover the second wiring layer and the second interlayerinsulating layer L2.

In this manner, the data lines 14 and potential lines 16 which areformed in the same layer (second wiring layer) adjacent to each otherinterpose the third interlayer insulating layer L3. As a result, thedata lines 14 and potential lines 16 which are adjacent to each otherare capacitively coupled, and a storage capacitor 50 is formed betweenthe two. The data lines 14 and potential lines 16 extending in the Ydirection from the upper part to the lower part of the display unit 100have a length equivalent to one side of the display unit 100, as shownin FIG. 2 . Accordingly, it is possible to set the capacitance Cdt ofthe storage capacitor 50 to a large value. Further, since the storagecapacitor 50 is formed using the data lines 14 and potential lines 16which are adjacent to each other, it is not necessary to make new space,and it is possible to provide a large capacitance Cdt.

As shown in FIG. 5 , by patterning a conductive wiring layer of aluminumor the like on the surface of the third interlayer insulating layer L3,a relay node N21 is formed at each pixel circuit 110 and a power supplylayer 116 a is continuously formed across the region corresponding tothe display unit 100. The power supply layer 116 a is formed from aconductive metal having a light reflecting property. Here, there arecases where the wiring layers formed on the surface of the thirdinterlayer insulating layer L3 are collectively referred to as thirdwiring layers.

The relay node N21 is connected to the relay node N11 through thecontact hole Hc1 passing through the third interlayer insulating layerL3.

Further, although omitted from the drawings, the power supply layer 116a is electrically connected to the power supply line 116.

As shown in FIG. 5 , a fourth interlayer insulating layer L4 is formedso as to cover the third wiring layers and the third interlayerinsulating layer L3.

The anode 130 a of the OLED 130 is formed on the fourth interlayerinsulating layer L4 by patterning a wiring layer having conductivity ofaluminum, ITO (Indium Tin Oxide), or the like.

These anodes 130 a are individual pixel electrodes for each pixelcircuit 110, and are connected to the relay node n21 through a contacthole Hd1 passing through the fourth interlayer insulating layer L4. Thatis, the anodes 130 a are connected to the P type diffusion layer P4 (inother words, the drain of the transistor 124) and the P type diffusionlayer P5 (in other words, the source of the transistor 125) through therelay node N21, the relay node N11 and the relay node N4.

In the electro-optical device 10, the structure after the anodes 130 ais omitted from the drawing; however, a light-emitting layer formed ofan organic EL material divided for each pixel circuit 110 is laminatedon the anodes 130 a. Here, a cathode (common electrode 118) which is acommon transparent electrode is provided across all of the plurality ofpixel circuits 110 on the light-emitting layer.

That is, the OLED 130 interposes the light-emitting layer between theanode 130 a and the common electrode 118 opposite to each other, andemits light with a luminance according to the current flowing toward thecommon electrode 118 from the anode 130 a. In the light emitted from theOLED 130, the light in the direction opposite (that is, the upwarddirection in FIG. 5 ) to the silicon substrate 150 is visible to anobserver as an image (top emission structure).

In addition to this, a sealing material or the like for sealing thelight-emitting layer from the atmosphere is provided; however,description thereof is omitted.

Here, as described above, since the power supply layer 116 a is formedso as to cover approximately the whole surface of the display unit 100,almost all of the light toward the silicon substrate 150 in the lightemitted from the OLED 130 is irradiated in a direction opposite to thesilicon substrate 150. Accordingly, the electro-optical device 10according to the present embodiment is capable of increasing the useefficiency of the light and reducing the power consumption. Further,since the light emitted from the OLED 130 is blocked by the power supplylayer 116 a, it is possible to protect the wiring layers, thetransistors 121 to 125, and the like, which are formed closer to thesilicon substrate 150 side than the third interlayer insulating layerL3, from the light.

In the present embodiment, the contact hole Ha8 and the contact hole Hb4are provided at different positions when viewed in plan view; however,they may be provided so as to overlap with each other when viewed inplan view. Similarly, the contact hole Ha9 and the contact hole Hb5 mayalso be provided so as to overlap with each other when viewed in planview. Further, the contact hole Ha4 and the contact hole Hb2 may also beprovided so as to overlap with each other when viewed in plan view.

Further, in the present embodiment, the storage capacitor 132 isconfigured by interposing the gate insulating layer L0 with the gateelectrode G1 and the P type diffusion layer P8; however, it may beformed by interposing the insulating layer with wiring layers which aredifferent to each other. For example, the storage capacitor 132 may beformed by interposing the second interlayer insulating layer L2 with thefirst wiring layer and the second wiring layer.

Operation of the First Embodiment

Description will be given of the operation of the electro-optical device10 with reference to FIG. 6 . FIG. 6 is a timing chart for illustratingoperations of each portion in the electro-optical device 10.

As shown in the drawing, the scanning signals Gwr(1) to Gwr(m) aresequentially switched to the L level and, in the period of one frame,the first to the m-th rows of scanning lines 12 are scanned in order foreach single horizontal scanning period (H).

The operation in the single horizontal scanning period (H) is commonacross the pixel circuits 110 of each row. In the following, descriptionwill be given of the operation in a scanning period in which an i-th rowis horizontally scanned with particular focus on the pixel circuit 110of the i row (3j−2) column.

In the present embodiment, when classifying the scanning periods of thei-th row, in FIG. 6 , the periods are divided into an initializationperiod shown by (b), a compensation period shown by (c), and a writingperiod shown by (d). Here, after the writing period of (d), after apause, a light-emitting period shown by (a) is started, and the scanningperiod of the i-th row is reached again after the passing of the periodof one frame. For this reason, regarding the chronological order, acycle of (light-emitting period)→initialization period→compensationperiod→writing period→(light-emitting period) is repeated.

Here, in FIG. 6 , each of the scanning signal Gwr(i−1), the controlsignals Gel(i−1), Gcmp(i−1) and Gorst(i−1) corresponding to the (i−1)-throw one row before the i row forms a waveform which is earlier than eachof the scanning signal Gwr(i), and the control signals Gel(i), Gcmp(i)and Gorst (i) corresponding to the i row by a single horizontal scanningperiod (H) only.

Light-Emitting Period

For convenience of explanation, description will be given from thelight-emitting period which is a prerequisite for the initializationperiod. As shown in FIG. 6 , in the light-emitting period of the i-throw, the scanning signal Gwr(i) is the H level and the control signalGel(i) is the L level. In addition, among the control signals Gel(i),Gcmp(i), and Gorst(i) which are logic signals, the control signal Gel(i)is the L level, and the control signals Gcmp(i) and Gorst(i) are the Hlevel.

For this reason, in the pixel circuits 110 of the i row (3j−2) column asshown in FIG. 7 , the transistor 124 is turned on while the transistors122, 123, and 125 are turned off. Therefore, the transistor 121 suppliesa current Ids according to the voltage Vgs between the gate and thesource to the OLED 130. As will be described later, the Vgs voltage inthe light-emitting period in the present embodiment is a valuelevel-shifted according to the potential of the data signals from thethreshold voltage of the transistor 121. For this reason, in the OLED130, the current according to the gradation level is supplied in a statewhere the threshold voltage of the transistor 121 is compensated.

In addition, since the light-emitting period of the i-th row is a periodin which horizontal scanning of other than the i-th row is performed,the potential of the data lines 14 is appropriately changed. However, inthe pixel circuit 110 of the i-th row, since the transistor 122 isturned off, here, potential changes of the data lines 14 are notconsidered.

In addition, in FIG. 7 , the path which is important in the descriptionof the operation is shown with a bold line (the same applies in FIGS. 8to 10 , and FIGS. 15 to 18 below).

Initialization Period

Next, when the scanning period of the i-th row is reached, first, theinitialization period of (b) is started as the first period. In theinitialization period, in comparison with the light-emitting period, thecontrol signal Gel(i) is changed to the H level and the control signalGorst(i) is changed to the L level, respectively.

For this reason, as shown in FIG. 8 , in the pixel circuit 110 of the irow (3j−2) column, the transistor 124 is turned off and the transistor125 is turned on. In this manner, the path of the current supplied tothe OLED 130 is interrupted and the anodes of the OLED 130 are reset tothe potential Vorst.

Since the OLED 130 has a configuration in which the organic EL layer isinterposed by the anode and the cathode as described above, as shown bya broken line in the drawing, a capacitor Coled has a parasitic effectin parallel between the anode and the cathode. When the current wasflowing in OLED 130 in the light-emitting period, the voltages of bothends between the anode and the cathode of the OLED 130 are held by thecapacitor Coled; however, the held voltage is reset by turning on thetransistor 125. For this reason, in the present embodiment, when thecurrent flows again to the OLED 130 in the subsequent light-emittingperiod, it is not easily affected by the influence of the voltage heldby the capacitor Coled.

In detail, for example, when a high luminance display state is changedto a low luminance display state, if the configuration is one which isnot reset, since a high voltage of the time when the luminance was high(a large current was flowing) is held, next, an excessive current ismade to flow when trying to make a small current flow and it becomesimpossible to obtain the low luminance display state. In contrast, inthe present embodiment, since the potential of the anode of the OLED 130is reset by turning the transistor 125 on, the reproducibility of thelow luminance side can be improved.

In this embodiment, regarding the potential Vorst, the differencebetween the potential Vorst and the potential Vct of the commonelectrode 118 is set so as to fall below the light-emitting thresholdvoltage of the OLED 130. For this reason, in the initialization period(the compensation period and writing period described next), the OLED130 is in an off (non-light-emitting) state.

On the other hand, in the initialization period, since the controlsignal /Gini is the L level and the Control signal Gref is the H level,the transistors 45 and 43 as shown in FIG. 8 are respectively turned onin the level shift circuit 40. For this reason, the data line 14 whichis one end of the storage capacitor 44 is initialized to the potentialVini and the node h which is the other end of the storage capacitor 44is initialized to the potential Vref, respectively.

Regarding the potential Vini in the present embodiment, (Vel−Vini) isset to be larger than the threshold voltage |Vth| of the transistor 121.In addition, since the transistor 121 is a P channel type, the thresholdvoltage Vth based on the potential of the source node is negative. Here,in order to prevent confusion in the description of the relationshipbetween high and low, the threshold voltage is set to be expressed bythe absolute value |Vth| and regulated by magnitude correlation.

In addition, with respect to the potential which can be taken by thedata signals Vd(1) to Vd(n), the potential Vref in the presentembodiment is set to a value such that the potential of the node h inthe subsequent writing period is increased, for example, set to be lowerthan the minimum value Vmin.

Compensation Period

In the scanning period of the i-th row, next, the compensation period of(c) is the second period. In the compensation period, in comparison withthe initialization period, the scanning signal Gwr(i) and the controlsignal Gcmp(i) are the L level. Meanwhile, in the compensation period,the control signal /Gini is the H level in a state where the controlsignal Gref is maintained at the H level.

For this reason, as shown in FIG. 9 , in the level shift circuit 40, thenode h is fixed at the potential Vref by turning off the transistor 45in a state where the transistor 43 is turned on. Meanwhile, since thegate node g is electrically connected to the data lines 14 by turning onthe transistor 122 in the pixel circuit 110 of the i row (3j−2) column,the gate node g becomes the potential Vini at the start of thecompensation period.

Since the transistor 123 is turned on in the compensation period, thetransistor 121 becomes a diode connection. For this reason, the draincurrent flows in the transistor 121 and charges the gate node g and thedata lines 14. In detail, the current flows in a path of the powersupply line 116→the transistor 121→transistor 123→the transistor 122→thedata line 14 of the (3j−2)-th column. For this reason, the data lines 14and the gate node g which are in a mutually connected state due to theturning on of the transistor 121 are increased from the potential Vini.

However, since the current flowing in the above path flows less easilyas the gate node g approaches the potential (Vel−|Vth|), the data line14 and the gate node g are saturated by the potential (Vel−|Vth|) untilthe end of the compensation period is reached. Accordingly, the storagecapacitor 132 holds the threshold voltage |Vth| of the transistor 121until the end of the compensation period is reached.

Writing Period

After the initialization period, the writing period of (d) as the thirdperiod is reached. In the writing period, since the control signalGcmp(i) becomes the H level, the diode connection of the transistor 121is canceled, while since the control signal Gref becomes the L level,the transistor 43 is turned off. For this reason, the path from the dataline 14 of the (3j−2)-th column to the gate node g in the pixel circuit110 of the i row (3j−2) column is in a floating state, but the potentialin the path is maintained at (Vel−|Vth|) by the storage capacitors 50and 132.

For a j-numbered group, the control circuit 5 in the writing period ofthe i row switches the data signals Vd(j) in order to a potentialaccording to the gradation level of pixels of the i row (3j−2) column,the i row (3j−1) column, and the i row (3j) column. Meanwhile, thecontrol circuit 5 sets the control signals Sel(1), Sel(2), and Sel(3) inorder exclusively to the H level in accordance with the switching of thepotential of the data signal. The control circuit 5 has been omitted inFIG. 6 ; however, output is also performed for the control signals/Sel(1), /Sel(2), and /Sel(3) which have an inverse logic relationshipwith the control signals Sel(1), Sel(2), and Sel(3). In this manner, inthe demultiplexer 30, the transmission gates 34 in each group are turnedon in order of the left end column, the center column, and the right endcolumn, respectively.

Here, when the transmission gate 34 of the left end column is turned onby the control signals Sel(1), and /Sel(1), as shown in FIG. 10 , thenode h which is the other end of the storage capacitor 44 is changedfrom the potential Vref fixed in the initialization period and thecompensation period to the potential of the data signal Vd(j), that is,to a potential according to the gradation level of pixels of the i row(3j−2) column. The potential change amount of the node h at this time isset as ΔV and the potential after the change is set to be expressed as(Vref+ΔV).

Meanwhile, since the gate node g is connected to one end of the storagecapacitor 44 through the data lines 14, it has a value (Vel−|Vth|+k1·ΔV)shifted upwards from the potential (Vel−|Vth|) in the compensationperiod by a value in which the potential change amount ΔV of the node his multiplied by the capacitance ratio k1 only. At this time, thevoltage Vgs of the transistor 121 becomes a value (|Vth|−k1·ΔV) in whichthe shifting amount of the increased potential of the gate node g onlyis subtracted from the threshold voltage |Vth|.

Here, the capacitance ratio k1 is Crf1/(Cdt+Crf1). Strictly speaking,the capacitance Cpix of the storage capacitor 132 must also beconsidered; however, since the capacitance Cpix is set so as to becomesufficiently small in comparison with the capacities Crf1 and Cdt, ithas been ignored.

FIG. 11 is a view showing the relationship between the potential of thedata signal and the potential of the gate node g in the writing period.The data signal supplied from the control circuit 5 can take a potentialrange of from the minimum value Vmin to the maximum value Vmax accordingto the gradation level of the pixels as described above. In the presentembodiment, the data signals are not written directly to the gate nodeg, but are level-shifted as shown in the drawing and written to the gatenode g.

At this time, the potential range ΔVgate of the gate node g iscompressed to a value in which the potential range ΔVdata (=Vmax−Vmin)of the data signal is multiplied by the capacitance ratio k1. Forexample, when the capacities of the storage capacitors 44 and 50 are setso that Crf1:Cdt=1:9, it is possible to compress the potential rangeΔVgate of the gate node g to 1/10 of the potential range ΔVdata of thedata signal.

In addition, regarding in which direction and to what extent thepotential range ΔVgate of the gate node g is shifted with respect to thepotential range ΔVdata of the data signal, determination can be madewith the potential Vp (Vel−|Vth|), and Vref. This is because thepotential range ΔVdata of the data signal is compressed by thecapacitance ratio k1 based on the potential Vref and one in which thecompression range is shifted based on the potential Vp becomes thepotential range ΔVgate of the gate node g.

In the writing period of such an i-th row, a potential (Vel−|Vth|+k1·ΔV)shifted from a potential (Vel−|Vth|) in the compensation period by anamount in which the potential change amount ΔV of the node h ismultiplied by the capacitance ratio k1 is written to the gate node g ofthe pixel circuit 110 of the i-th row.

Eventually, the scanning signal Gwr(i) becomes the H level and thetransistor 122 is turned off. In this manner, the writing period isfinished and the potential of the gate node g is confirmed at theshifted value.

Light-Emitting Period

After the writing period of the i-th row is finished, the light-emittingperiod is reached during the single horizontal scanning period. In thislight-emitting period, since the control signal Gel(i) as describedabove becomes the L level, the transistors 124 in the pixel circuits 110of the i row (3j−2) columns are turned on. Since the voltage Vgs betweenthe gate and the source is (|Vth|−k1·ΔV), as shown in the previous FIG.7 , the current according to the gradation level is supplied to the OLED130 in a state where the threshold voltage of the transistor 121 iscompensated.

Such an operation is performed in parallel in terms of time in thescanning period of the i-th row and the also in the other pixel circuits110 of the i-th row other than the pixel circuits 110 of the (3j−2)-thcolumn. In addition, such an operation of the i-th row is in practiceperformed in the order of 1, 2, 3, . . . , (m−1), and m-th row in theperiod of one frame, and is repeated for each frame.

Effect of the First Embodiment

Since the storage capacitor 50 is formed by interposing the thirdinterlayer insulating layer L3 with the data lines 14 and the potentiallines 16 having lengths equivalent to one side of the display unit 100,it is possible to set the capacitance Cdt of the storage capacitor 50 toa large value. The capacitance Cdt is sufficiently large in comparisonwith the capacitance Cpix of the storage capacitor 132 formed inside thepixel circuit 110 and, moreover, is large in comparison with thecapacitance Crf1 of the storage capacitor 44 formed in the regionlimited by the outside of the display unit 100. Accordingly, it ispossible to set the capacitance ratio k1 of the capacitance Cdt and thecapacitance Crf1 to a small value.

That is, according to the present embodiment, by setting the capacitanceratio k1 to a small value, it is possible to compress the potentialrange ΔVgate in the gate node g to a sufficiently small value withrespect to the potential range ΔVdata of the data signals. In thismanner, even without cutting up the data signals with fine precision, itis possible to apply a voltage reflecting the gradation level betweenthe gate and source of the transistor 121. Thus, even in a case where amicro current flowing in the OLED 130 with respect to changes in thevoltage Vgs between the gate and source of the transistor 121 in theminiature pixel circuit 110 is changed to a relatively large extent, itis possible to control the current supplied to the OLED 130 with goodprecision.

According to the present embodiment, the storage capacitor 50 is formedby data lines 14 and potential lines 16 having lengths equivalent tosides of the display unit 100. That is, the capacitance Cdt of thestorage capacitor 50 is formed by electrodes having a large area. Thevariation of each column of the storage capacitor 50 depends on theerrors in the semiconductor processing; however, by forming the storagecapacitor 50 using an electrode with a large area, it is possible toreduce the relative variation of the capacitance Cdt of the storagecapacitor 50. Accordingly, if it is possible to suppress the variationof each column of the capacitance Crf1 of the storage capacitor 44 to besmall, it is also possible to suppress the variation of each column forthe capacitance ratio k1 of capacitance Cdt and capacitance Crf1. Inthis manner, it is possible to suppress the generation of luminanceunevenness caused by variation in the capacitance ratio k1.

Further, each of the storage capacitors 50 provided in each column isprovided in common to m pixel circuits 110 connected to each data line14. For this reason, it is possible to provide a large capacitance ineach pixel circuit 110 without forming a large storage capacitanceinside the pixel circuits 110, and it is possible to achieve bothminiaturization of the pixel circuits 110 and improvement of the displayquality.

Here, in the writing period, in a case where the data signal Vd(j) issupplied to the other end of the storage capacitor 44, charge transferis generated from one end of the storage capacitor 44 with respect tothe storage capacitor 132 and the storage capacitor 50. That is, thepresent embodiment determines the potential of the gate node g bydistributing a charge supplied from one end of the storage capacitor 44in the writing period to the storage capacitor 132 and the storagecapacitor 50.

More specifically, the charge supplied from one end of the storagecapacitor 44 in the writing period is distributed to the storagecapacitor 50 and the storage capacitor 132 according to the capacitanceratio of the storage capacitor 50 and the storage capacitor 132. Thus,the potential change amount of the gate node g in the writing period isdetermined based on the capacitance Cdt of the storage capacitor 50 andthe charge distributed to the storage capacitor 50 and the capacitanceCpix of the storage capacitor 132 and the charge distributed to thestorage capacitor 132. Since the capacitance Cdt of the storagecapacitor 50 is sufficiently large in comparison with the capacitanceCpix of the storage capacitor 132, the potential change amount of thegate node g in the writing period is substantially determined accordingto the capacitance Cdt of the storage capacitor 50 and the chargedistributed to the storage capacitor 50. As described above, thevariation in the capacitance Cdt for each column is small. Accordingly,according to the present embodiment, it is possible to suppress thevariation for each column of the potential change amount of the gatenode g in the writing period.

In contrast, even if the electro-optical device 10 is not provided witha storage capacitor 50, the charge supplied from one end of the storagecapacitor 44 in the writing period is held by the storage capacitor 132.In other words, in a case where the electro-optical device 10 is notprovided with a storage capacitor 50, the potential change amount of thegate node g in the writing period is determined by the charge suppliedfrom one end of the storage capacitor 44 in the writing period and thecapacitance Cpix of the storage capacitor 132. Since the storagecapacitor 132 is formed inside the miniature pixel circuit 110, therelative variation of the capacitance Cpix is large in comparison withthe relative variation of the capacitance Cdt. Accordingly, in such acase, the variation for each column of the potential change amount ofthe gate node g in the writing period becomes large.

In this manner, according to the present embodiment, since it ispossible to reduce the relative variation of the potential change amountof the gate node g in the writing period by providing the storagecapacitor 50, it is possible to suppress the generation of luminanceunevenness and to improve the display quality.

In addition, between the data lines 14 shown by a broken line in FIG. 3and the gate node g in the pixel circuit 110 there is a parasiticcapacitance Cprs in practice. For this reason, if the potential changerange of the data line 14 is large, there is propagation to the gatenode g through capacitance Cprs, whereby so-called cross-talk,non-uniformity, or the like is generated and the display quality isdeteriorated. The influence of the capacitance Cprs is remarkablyapparent when the pixel circuit 110 is miniaturized.

In contrast, in the present embodiment, since the potential change rangeof the data lines 14 is also narrowed with respect to the potentialrange ΔVdata of the data signal, it is possible to suppress theinfluence through the capacitance Cprs.

According to the present embodiment, since it is possible to preserve aperiod which is longer than the scanning period, for example, 2horizontal scanning periods, as the period in which the transistor 125is turned on, that is, the reset period of the OLED 130, it is possibleto sufficiently initialize the voltage held in the parasitic capacitanceof the OLED 130 in the light-emitting period.

In addition, according to the present embodiment, in the current Idssupplied to the OLED 130 by the transistor 121, the influence of thethreshold voltage is canceled out. For this reason, according to thepresent embodiment, even if the threshold voltage of the transistor 121varies for each pixel circuit 110, since the variations are compensatedand the current according to the gradation level is supplied to the OLED130, the generation of display non-uniformity adversely affecting theuniformity of the display screen is suppressed and, as a result, ahigh-quality display is possible.

Description will be given of this cancelling out with reference to FIG.12 . As shown in this drawing, in order to control the small currentsupplied to the OLED 130, the transistor 121 operates in a weakinversion region (sub-threshold region).

In the drawing, A illustrates a transistor for which the thresholdvoltage |Vth| is large and B illustrates a transistor for which thethreshold voltage |Vth| is small, respectively. Here, in FIG. 12 , thevoltage Vgs between the gate and the source is the difference betweenthe characteristic shown by the solid line and the potential Vel.Further, in FIG. 12 , the current of the vertical scale is shown by alogarithm in which the direction from the source toward the drain is setas positive (up).

The gate node g in the compensation period becomes a potential(Vel−|Vth|) from the potential Vini. For this reason, for the transistorA in which the threshold voltage |Vth| is large, the operation pointmoves from S to Aa while, for the transistor B in which the thresholdvoltage |Vth| is small, the operation point moves from S to Ba.

Next, In a case where the potentials of the data signals to the pixelcircuits 110 to which the two transistors belong are the same, that is,in a case where the same gradation level is indicated, in the writingperiod, the potential shift amounts from the operation points Aa and Baare both the same k1·Δ. For this reason, for transistor A, the operationpoint moves from Aa to Ab, and for transistor B, the operation pointmoves from Ba to Bb; however, the currents at the operation points afterthe potential shift are aligned at almost the same Ids for both thetransistors A and B.

Second Embodiment

In the first embodiment, a configuration is adopted in which datasignals are directly supplied by the demultiplexer 30 to the other endsof the storage capacitors 44 of each column, that is, to the nodes h.For this reason, in the scanning period of each row, since the period inwhich the data signals are supplied by the control circuit 5 is equal tothe writing period, the time constraints are large.

Here, description will be given of the second embodiment in which it ispossible to relax such time constraints. Here, in the following, inorder to avoid duplication of explanation, description will be givenwith a focus on the parts which are different to the first embodiment.

FIG. 13 is a view showing a configuration of an electro-optical device10 according to the second embodiment.

The points where the second embodiment shown in the drawing is differentto the first embodiment shown in FIG. 2 are mainly the points that astorage capacitor 41 and a transmission gate 42 are provided in eachcolumn of the level shift circuit 40.

In detail, the transmission gates 42 in each column are electricallyinterposed between the output ends of the transmission gate 34 and theother ends of the storage capacitor 44. That is, the input end of thetransmission gate 42 is connected to the output end of the transmissiongate 34, and the output end of the transmission gate 42 is connected tothe other end of the storage capacitor 44. For this reason, thetransmission gate 42 functions as a first switch.

Here, the transmission gates 42 of each column are turned on as a groupwhen the control signal Gcpl supplied from the control circuit 5 is theH level (when the control signal /Gcpl is the L level).

On the other hand, the transmission gate 34 in the demultiplexer 30functions as a second switch.

In addition, one end of the storage capacitors 41 in each column isconnected to the output end of transmission gate 34 (input end of thetransmission gate 42), and the other end of the storage capacitors 41 isgrounded in common at a fixed potential, for example, a potential Vss.Although omitted from FIG. 13 , the capacitance of the storage capacitor41 is set as Crf2. Here, the potential Vss is equivalent to the L levelof the scanning signals or control signals, which are logic signals.

Operation of the Second Embodiment

Description will be given of the operation of the electro-optical device10 according to the second embodiment with reference to FIG. 14 . FIG.14 is a timing chart for illustrating the operation of the secondembodiment.

As shown in the drawing, the point that the scanning signals Gwr(1) toGwr(m) are sequentially switched to the L level and, in the period ofone frame, the first to the m-th rows of scanning lines 12 are scannedin order for each single horizontal scanning period (H), is the same asthe first embodiment. Further, in the second embodiment, the point thatthe scanning period of the i-th row follows the order of aninitialization period shown by (b), a compensation period shown by (c),and a writing period shown by (d) is also the same as the firstembodiment. Here, the writing period of (d) in the second embodiment isa period from the time the control signal Gcpl changes from the L to theH level (time when the control signal /Gcpl has become the L level) tothe time when the scanning signal changes from the L to the H level.

In the second embodiment, similarly to the first embodiment, regardingthe chronological order, a cycle of (light-emittingperiod)→initialization period→compensation period→writingperiod→(light-emitting period) is repeated. However, in the secondembodiment, in comparison with the first embodiment, the supply periodof the data signal is not equal to the writing period, and there is adifference in the point that the supply of the data signal precedes thewriting period. In detail, the point that, in the second embodiment, thedata signal can be supplied across the initialization period of (a) andthe compensation period of (b) is different from the first embodiment.

Light-Emitting Period

In the second embodiment, as shown in FIG. 14 , the scanning signalGwr(i) in the light-emitting period of the i-th row is the H level, and,the control signal Gel(i) is the L level, and the control signalsGcmp(i) and Gorst(i) are the H level.

For this reason, in the pixel circuit 110 of i row (3j−2) column asshown in FIG. 15 , since the transistor 124 is turned on while thetransistors 122, 123, and 125 are turned off, the operation of the pixelcircuit 110 is basically the same as the first embodiment. In otherwords, the transistor 121 supplies a current Ids according to thevoltage Vgs between the gate and the source to the OLED 130.

Initialization Period

Upon reaching the scanning period of the i-th row, first, theinitialization period of (b) is started.

In the initialization period in the second embodiment, in comparisonwith the light-emitting period, the control signal Gel(i) is changed tothe H level and the control signal Gorst(i) is changed to the L level,respectively.

For this reason, as shown in FIG. 16 , in the pixel circuit 110 of the irow (3j−2) column, the transistor 124 is turned off and the transistor125 is turned on. In this manner, since the path of the current suppliedto the OLED 130 is interrupted and the anodes of the OLED 130 are resetto the potential Vorst by the turning on of the transistor 124, theoperation of the pixel circuit 110 is basically the same as the firstembodiment.

Meanwhile, in the initialization period in the second embodiment, thecontrol signal /Gini becomes the L level, the control signal Grefbecomes the H level, and the control signal Gcpl becomes the L level.For this reason, in the level shift circuit 40, the transistors 45 and43 are respectively turned on as shown in FIG. 16 and the transmissiongate 42 is turned off. Accordingly, the data line 14 which is one end ofthe storage capacitor 44 is initialized to the potential Vini and thenode h which is the other end of the storage capacitor 44 is initializedto the potential Vref, respectively.

The potential Vref in the second embodiment is set to a value such thatthe potential of the node h in the subsequent writing period can beincreased with respect to the potential which can be taken by the datasignals Vd(1) to Vd(n), similarly to the first embodiment.

As described above, the control circuit 5 in the second embodimentsupplies data signals across the initialization period and thecompensation period. That is, for a j-numbered group, the controlcircuit 5 switches the data signals Vd(j) in order to a potentialaccording to the gradation level of pixels of the i row (3j−2) column,the i row (3j−1) column, and the i row (3j) column while setting thecontrol signals Sel(1), Sel(2), and Sel(3) in order exclusively to the Hlevel in accordance with the switching of the potential of the datasignal. In this manner, in the demultiplexer 30, the transmission gates34 in each group are turned on in order of the left end column, thecenter column, and the right end column, respectively.

Here, in the initialization period, in a case where the transmissiongate 34 of the left end side belonging to the j-numbered group is turnedon by the control signal Sel(1), as shown in FIG. 16 , since the datasignal Vd(j) is supplied to one end of the storage capacitor 41, thedata signal is held by the storage capacitor 41.

Compensation Period

In the scanning period of the i-th row, the compensation period of (c)is next. In the compensation period in the second embodiment, incomparison with the initialization period, the scanning signal Gwr(i) ischanged to the L level and the control signal Gcmp(i) is changed to theL level, respectively.

For this reason, as shown in FIG. 17 , the transistor 122 is turned onin the pixel circuit 110 of the i row (3j−2) column and the gate node gis electrically connected to the data lines 14, while the transistor 121becomes a diode connection due to the turning on of the transistor 123.

Accordingly, since the current flows in the path of the power supplyline 116→transistor 121→transistor 123→transistor 122→data line 14 of(3j−2)-th column, the gate node g is increased from the potential Viniand is eventually saturated at (Vel−|Vth|). Accordingly, even in thesecond embodiment, the storage capacitor 132 holds the threshold voltage|Vth| of the transistor 121 until the end of the compensation period isreached.

In the second embodiment, since the control signal /Gini becomes the Hlevel in a state where the control signal Gref is maintained at the Hlevel in the compensation period, the node h in the level shift circuit40 is fixed at a potential Vref.

In addition, in the compensation period, in a case where thetransmission gate 34 of the left end side belonging to the j-numberedgroup is turned on by the control signal Sel(1), as shown in FIG. 17 ,the data signal Vd(j) is held by the storage capacitor 41.

Here, in the initialization period, in a case where the transmissiongate 34 of the left end column belonging to the j-numbered group arealready turned on by the control signal Sel(1), in the compensationperiod, the transmission gate 34 is not turned on; however, there is nochange in the point that the data signal Vd(j) is held by the storagecapacitor 41.

In addition, when the compensation period is finished, since the controlsignal Gcmp(i) is the H level, the diode connection of the transistor121 is canceled.

In the second embodiment, since the control signal Gref becomes the Llevel during the period from the end of the compensation period untilthe next writing period starts, the transistor 43 is turned off. Forthis reason, the path leading up to the gate node g in the pixel circuit110 of i row (3j−2) column from the data line 14 of the (3j−2)-th columnbecomes a floating state, but the potential in the path is maintained at(Vel−|Vth|) by the storage capacitors 50 and 132.

Writing Period

In the writing period in the second embodiment, the control signal Gcplbecomes the H level (control signal /Gcpl becomes the L level). For thisreason, as shown in FIG. 18 , since the transmission gate 42 is turnedon in the level shift circuit 40, the data signal held by the storagecapacitor 41 is supplied to the node h which is the other end of thestorage capacitor 44. For this reason, the node h shifts from thepotential Vref in the compensation period. In other words, the node h ischanged to the potential (Vref+ΔV).

Meanwhile, since the gate node g is connected to one end of the storagecapacitor 44 through the data lines 14, it has a value shifted upwardsfrom the potential (Vel−|Vth|) in the compensation period by a value inwhich the potential change amount ΔV of the node h is multiplied by thecapacitance ratio k2 only. In other words, the potential of the gatenode g becomes a value (Vel−|Vth|+k2·Δ) shifted upwards from thepotential (Vel−|Vth|) in the compensation period by a value in which thepotential change amount ΔV of the node h is multiplied by thecapacitance ratio k2 only.

Here, in the second embodiment, the capacitance ratio k2 is thecapacitance ratio of Cdt, Crf1, and Crf2. As described above, thecapacitance Cpix of the storage capacitor 132 is ignored.

Further, at this time, the voltage Vgs of the transistor 121 becomes avalue (|Vth|−k2·ΔV) decreased by the amount which the potential of thegate node g shifts upward from the threshold voltage |Vth|.

Light-Emitting Period

In the second embodiment, after the writing period of the i-th row isfinished, the light-emitting period is reached during the singlehorizontal scanning period. In this light-emitting period, since thecontrol signal Gel(i) as described above becomes the L level, thetransistors 124 in the pixel circuits 110 of the i row (3j−2) columnsare turned on.

The voltage Vgs between the gate and the source is (|Vth|−k2·ΔV) and isa value level-shifted according to the potential of the data signal fromthe threshold voltage of the transistor 121. For this reason, as shownin the previous FIG. 15 , the current according to the gradation levelis supplied to the OLED 130 in a state where the threshold voltage ofthe transistor 121 is compensated.

Such an operation is performed in parallel in terms of time in thescanning period of the i-th row and the also in the other pixel circuits110 of the i-th row other than the pixel circuits 110 of the (3j−2)-thcolumn. In addition, such an operation of the i-th row is in practiceperformed in the order of 1, 2, 3, . . . , (m−1), and m-th row in theperiod of one frame, and is repeated for each frame.

Effect of the Second Embodiment

According to the second embodiment, similarly to the first embodiment,even in a case where a small current flowing through the OLED 130 withrespect to changes of the voltage Vgs between the gate and the source ofthe transistor 121 in the fine pixel circuit 110 is changed to arelatively large extent, it is possible to control the current suppliedto the OLED 130 with high precision.

According to the second embodiment, similarly to the first embodiment,as well as being able to sufficiently initialize the voltage held by theparasitic capacitance of the OLED 130 in the light-emitting period, evenif the threshold voltage of the transistor 121 varies for each pixelcircuit 110, the generation of display non-uniformity adverselyaffecting the uniformity of the display screen is suppressed and, as aresult, a high-quality display is possible.

According to the second embodiment, an operation of holding the datasignal supplied through the demultiplexer 30 from the control circuit 5in the storage capacitor 41 is performed from the initialization periodto the compensation period. For this reason, it is possible to relax thetime constraints on the operations to be performed in one horizontalscanning period.

For example, since, as the voltage Vgs between the gate and the sourcein the compensation period approaches the threshold voltage, the currentflowing in the transistor 121 deteriorates, time is required to bringthe gate node g to the potential (Vel−|Vth|); however, in the secondembodiment, it is possible to preserve a long compensation period asshown in FIG. 14 in comparison with the first embodiment. For thisreason, according to the second embodiment, in comparison with the firstembodiment, it is possible to compensate the variations of the thresholdvoltage of the transistor 121 with high precision.

In addition, it is possible to slow down the supply operation of thedata signal.

Application and Modification Examples

The invention is not limited to embodiments such as the above-describedembodiments and application examples, and, for example, variousmodifications are possible as described in the following. Further, oneor a plurality of arbitrarily selected forms of the modificationsdescribed below can also be combined as appropriate.

Control Circuit

In the embodiment described above, the control circuit 5 supplying datasignals is set as separate to the electro-optical device 10; however,the control circuit 5 may also be integrated in the silicon substratewith the scanning line driving circuit 20, the demultiplexer 30 and thelevel shift circuit 40.

Substrate

In the above-described embodiments and modification examples, aconfiguration has been adopted in which the electro-optical device 10 isintegrated in a silicon substrate; however, a configuration ofintegration with another semiconductor substrate may be adopted.Further, the device may be formed on a glass substrate or the like byapplying polysilicon processing. In any case, the pixel circuits 110 areminiaturized and useful in a configuration in which the drain current ischanged to exponentially increase with respect to changes in the gatevoltage Vgs in the transistor 121.

Demultiplexer

In the above-described embodiments and modification examples, aconfiguration is adopted in which the data lines 14 are grouped inthrees, the data lines 14 are selected in order in each group, and datasignals are supplied; however, the number of data lines configuring agroup may be 2 or may be 4 or more.

In addition, a configuration may be adopted in which the data signalsare supplied in line order together to the data lines 14 of each columnwithout grouping, that is, without using the demultiplexer 30.

Channel Type of Transistor

In the above-described embodiments and modification examples, thetransistors 121 to 125 in the pixel circuits 110 are standardized as Pchannel types; however, they may be standardized as N channel types.Further, the P channel types and N channel types may be appropriatelycombined.

Storage Capacitor

In the above-described embodiments and modification examples, thepotential of the gate node g and the data lines 14 was set through thestorage capacitor 44 by supplying the data signal Vd(j) to the other endof the storage capacitor 44; however, the invention is not limited tosuch a form, and the potential of the gate node g may be set bysupplying the data signal Vd(j) directly to the other end of the datalines 14. In such a case, the electro-optical device 10 need not beprovided with the storage capacitor 44 (or the storage capacitor 41).

Data Signal

In the above-described embodiments and modification examples, apotential according to the gradation level of the pixels is supplied asthe data signal Vd(j); however, the invention is not limited to such aform.

For example, a current of a size according to the gradation level of thepixels may be supplied as the data signal. Further, a fixed current maybe supplied for only a period of a length according to the gradationlevel of the pixels. In such cases, the current which is the data signalmay be directly supplied to the data lines 14 without going through thestorage capacitor 44.

That is, the above-described embodiments and modification examples movea charge with respect to the storage capacitor 50 and the storagecapacitor 132 from one end of the storage capacitor 44 and determine thepotential of the gate node g by setting other end of the storagecapacitor 44 to the potential of the data signal Vd(j); however, thepresent modification example determines the potential of the gate node gby supplying, to the storage capacitor 50 and the storage capacitor 132,a charge of an amount according to the gradation level of the pixelsfrom a current source connected to an end portion of the data lines 14.

As described above, the charge supplied from the current source isdistributed by the capacitance Cdt of the storage capacitor 50 and thecapacitance Cpix of the storage capacitor 132. Since the capacitance Cdtof the storage capacitor 50 is sufficiently large in comparison with thecapacitance Cpix of the storage capacitor 132, the potential changeamount of the gate node g is substantially determined according to thecharge supplied from the power source and the capacitance Cdt of thestorage capacitor 50. Thus, since the relative variation of thecapacitance Cdt of the storage capacitor 50 is small, it is possible tosuppress the relative variation of the potential change amount of thegate node g in the writing period to be small. In this manner, it ispossible to suppress the generation of luminance unevenness and toimprove the display quality.

Arrangement of Potential Lines and Data Lines

In the above-described embodiments and modification examples, among thepotential lines 16 and data lines 14 forming the storage capacitor 50(that is, the potential lines 16 and data lines 14 which are adjacent toeach other), the data lines 14 are electrically connected to atransistor 125 provided in one pixel circuit 110 out of two pixelcircuits 110 which are adjacent to each other in the X direction (firstdirection), and the potential lines 16 are electrically connected to atransistor 122 provided in the other pixel circuit 110 out of the twopixel circuits 110; however, the invention is not limited to such aform.

For example, as shown in FIG. 19 , the potential lines 16 and data lines14 forming the storage capacitor 50 may be respectively electricallyconnected to the transistors 121 and 125 provided in the same pixelcircuit 110. In such a case, in the display unit 100, (3n) potentiallines 16 and (3n) data lines 14 may be provided so as to correspond oneto one.

Other

In such embodiments, an OLED which is a light-emitting element has beenexemplified as an electro-optical element; however, for example, it maybe one emitting light at a luminance according to the current such as aninorganic light-emitting diode or an LED (Light Emitting Diode).

Electronic Apparatus

Next, description will be given of an electronic apparatus applying theelectro-optical device 10 according to such embodiments or applicationexamples. The electro-optical device 10 is for high-definition displayapplications with small pixels. Thus, description will be given taking ahead mounted display as an example of the electronic apparatus.

FIG. 20 is a diagram showing the external appearance of a head mounteddisplay and FIG. 21 is a diagram showing the optical configurationthereof.

First, as shown in FIG. 20 , the head mounted display 300 includestemples 310, a bridge 320, and lenses 301L and 301R, which are similarto normal glasses in terms of the external appearance. In addition, asshown in FIG. 21 , in the head mounted display 300, at the far side(bottom side in the drawing) of the lenses 301L and 301R which are inthe vicinity of the bridge 320, an electro-optical device 10L for lefteye use and an electro-optical device 10R for right eye use areprovided.

The image display surface of the electro-optical device 10L is arrangedto be on the left side in FIG. 21 . In this manner, the display imageaccording to the electro-optical device 10L is emitted in the directionof 9 o'clock in the drawing through the optical lens 302L. A half mirror303L reflects the display image according to the electro-optical device10L in the 6 o'clock direction while allowing light incident from the 12o'clock direction to pass therethrough.

The image display surface of the electro-optical device 10R is arrangedso as to be on the right side opposite to the electro-optical device10L. In this manner, the display image according to the electro-opticaldevice 10R is emitted in the direction of 3 o'clock in the drawingthrough the optical lens 302R. A half mirror 303R reflects the displayimage according to the electro-optical device 10R in the 6 o'clockdirection while allowing light incident from the 12 o'clock direction topass therethrough.

In this configuration, the wearer of the head mounted display 300 canobserve the display image according to the electro-optical devices 10Land 10R in a see-through state superimposed with the outside view.

Further, in the head mounted display 300, with parallax images for botheyes, when an image for the left eye is displayed on the electro-opticaldevice 10L and an image for the right eye is displayed on theelectro-optical device 10R, the wearer can be made to perceive thedisplayed image as though it had a sense of depth or a stereoscopiceffect (3D display).

Here, in addition to the head mounted display 300, the electro-opticaldevice 10 can also be applied to an electronic viewfinder of a videocamera, a digital camera with interchangeable lenses, or the like.

What is claimed is:
 1. An electro-optical device comprising: a scanning line drive circuit configured to supply a first signal on a first line extending in a first direction; a data line extending in a second direction; a potential line; a first capacitor having a first end formed by at least a portion of the potential line; and a pixel circuit including: a driving transistor having a first gate, a first source, and a first drain, the driving transistor being configured to control a current level according to a voltage between the first gate and the first source; a writing transistor electrically connected between the first gate and the data line; a second capacitor having one end electrically connected to the first gate; a light-emitting element configured to emit light at a luminance according to the current level during a light-emitting period; and an initialization transistor configured to be on during an initialization period different from the light-emitting period, to control an electrical connection between the potential line and the light-emitting element, a gate of the initialization transistor being connected to the first line, wherein a second end of the first capacitor is formed by at least a portion of the data line.
 2. The electro-optical device according to claim 1, wherein the first signal is a control signal.
 3. The electro-optical device according to claim 1, wherein the first signal is a scanning signal.
 4. The electro-optical device according to claim 1, wherein the potential line includes a portion extending in the second direction.
 5. The electro-optical device according to claim 1, wherein the first end and the second end of the first capacitor are formed in the same layer. 